- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
Patent holdings for IPC class H05K 3/04
Total number of patents in this class: 292
10-year publication summary
27
|
31
|
20
|
19
|
19
|
34
|
39
|
18
|
17
|
4
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
GENTHERM GmbH | 249 |
13 |
Robert Bosch GmbH | 40953 |
6 |
Nederlandse Organisatie voor Toegepast-natuurwetenschappelijk Onderzoek TNO | 2362 |
6 |
3m Innovative Properties Company | 18406 |
5 |
Huawei Technologies Co., Ltd. | 100781 |
5 |
Raytheon Company | 8535 |
5 |
Xerox Corporation | 7503 |
4 |
E. I. du Pont de Nemours and Company | 4345 |
4 |
Intel Corporation | 45621 |
4 |
LG Innotek Co., Ltd. | 6758 |
4 |
Board of Regents, The University of Texas System | 5370 |
4 |
Avery Dennison Corporation | 1291 |
4 |
Radial Electronics, Inc. | 11 |
4 |
Unimicron Technology Corp. | 449 |
4 |
Richview Electronics Co., Ltd. | 20 |
4 |
Manaflex, LLC | 14 |
4 |
Shinko Electric Industries Co., Ltd. | 1186 |
3 |
at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 427 |
3 |
Avery Dennison Retail Information Services LLC | 1067 |
3 |
GENTHERM Incorporated | 277 |
3 |
Other owners | 200 |